DTIS 2014: 6-8 May 2014, Santorini, Greece

DTIS 2014 aims to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest include the design, test and technology of electronic products, ranging from integrated circuit modules and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products.

Topics of the conference include, but are not limited to:


Integrated Systems Design: Integrated Systems Technology: Integrated Systems Testing:
  • SOC, SIP design
  • Multiprocessor systems
  • Embedded systems
  • Wireless systems
  • Network on Chip
  • Analog, Mixed Signal and RF systems
  • MEMS and MOEMS systems
  • Low Voltage and Low Power systems
  • Innovative technologies
  • Synthesis (physical, logic)
  • Simulation, Validation and Verification
  • 3D integration
  • Hardware Security
  • Nanoelectronics
  • Device modeling
  • Material characterization
  • Failure analysis
  • New components
  • Packaging
  • Process technology
  • Reliability issues
  • 3D integration
  • Defect and fault modeling
  • Analog and Mixed Signal testing
  • MEMS/MOEMS testing
  • SOC and SIP testing
  • Delay testing
  • Memory testing
  • Fault Simulation, ATPG
  • DFT, BIST and BISR
  • On-line testing and fault tolerant systems
  • ATE issues
  • Alternative test strategies
  • 3D testing
  • Test and Security Issues